Solder Paste AP-10

PublishTime：2025-03-19

Solder Paste AP-10 is a solder paste without cleaner, air or nitrogen reflow. This formula has a wider process window and is more active on OSP boards than previous non-cleaner formulas. AP-10 solder paste maintains its activity and printing characteristics for up to 8 hours under shearing thinning conditions. AP-10 can withstand printing pauses of up to 60 minutes, and the first print effectiveness can be as low as 0.5 millimeters. The residue of AP-10 is light amber in color and free of solder balls. The solder paste residue is also light amber and can be cleaned with alcohol and/or commercial cleaners.

Brand of Product：	TAMURA ELSOLD
Part#：	AP-10 More Part#
Product Category：	焊膏 More
Application：	[ 空气或氮气再流焊 ] More
Data Type：	Technical Documentation More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
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Language：	English Chinese Chinese and English Japanese
Date of Creation：
Version Number：
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Data Size：	429 KB

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