TAMURA ELSOLD Solder Paste AP-40

PublishTime：2025-03-19

TAMURA ELSOLD Solder Paste AP-40 is an evolution of AP-20 solder paste, offering easier handling and a longer open time. AP-40 provides a very wide process window. The unique performance of the materials used allows users to process printed circuit boards for a longer time after printing without losing any of the original stickiness of the printed solder paste. This makes it possible to flexibly plan and implement various process steps of printed circuit board assembly in many cases. AP-40 is developed for lead-free soldering but also works well with tin/lead solder alloys, allowing the use of one solder paste flux for both lead-free and leaded processes. The use of chemically modified resin materials results in solder paste with very high reproducibility. For users, this means that the printing results from one board to another are always consistent. Under appropriate storage conditions, the viscosity of AP-40 remains almost unchanged. Therefore, solder paste AP-40 can be stored for at least 6 months (within the recommended storage temperature range) without reducing the excellent processing properties of the solder paste (good scraper rolling, anti-sagging, stickiness). Therefore, even small and medium-sized operations can enjoy the benefits of purchasing solder paste in quantities with economic appeal. TAMURA ELSOLD Solder Paste AP-40 is very suitable for fine-pitch applications. Optimized production processes and high-quality raw materials ensure good anti-sagging properties. The observed printed solder paste deposits do not sag, so there are no bridging or solder balls. The solder paste deposits show very consistent shapes and contours from printing to printing, from shift to shift (DIN 32513, 150 μm scraper, minimum spacing 0.2 mm, at room temperature and 5 minutes at 150 °C). In addition to these special benefits, TAMURA ELSOLD Solder Paste AP-40 also has a wide process window, meeting the diverse requirements of different PCB configurations whether under air or nitrogen. Although linear profiles will ensure the best results, in many cases, dipping profiles also produce good results. Using AP-40, excellent welding results can be achieved on all normal surfaces as well as on surfaces with different component surface treatments. The results of balling, wetting, and anti-sagging tests exceed customer requirements.

Brand of Product：	TAMURA ELSOLD
Part#：	AP-40 More Part#
Product Category：	Solder Paste More
Application：	[ Fine-pitch applications ][ PCB assembly ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	Jars, Cassettes, Cartridges, Syringes
Language：	English Chinese Chinese and English Japanese
Date of Creation：
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Data Size：	585 KB

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