Lead-free Solder Paste SM-388

PublishTime：2025-03-19

The SM-388 solder paste is a lead-free product designed for reliable lead-free solder joints. It utilizes a highly heat stable synthetic resin as its flux base, resulting in lighter colored residues after reflow compared to traditional solder pastes. The paste meets the requirements of class REL0 of J-STD-004 and DIN EN 61190-1-1 specifications. It is a no-clean paste, with a flux that includes additives like high-boiling solvents, corrosion inhibitors, thixotropic agents, and heat stable resins. The paste is suitable for SMT applications and has good printing and slump characteristics. It is also resistant to moisture and water, reducing the formation of "white powdery residues" after cleaning.

Brand of Product：	TAMURA ELSOLD
Part#：	SM-388 More Part#
Product Category：	Solder Paste More
Application：	[ SMT applications ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
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Language：	English Chinese Chinese and English Japanese
Date of Creation：
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Data Size：	528 KB

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