Solder Paste AP-10

PublishTime：2025-03-19

Solder Paste AP-10 is a no clean, air or nitrogen reflowable solder paste designed for use in various electronic manufacturing processes. It features excellent wetting behavior on most surfaces, high printing speeds up to 120 mm/s, and long stencil life of more than 6 hours. The paste is suitable for BGA and µBGA applications and has a very good tack time for up to 24 hours. It is classified as ROL1 according to J-STD-004 standards and exhibits very good printing characteristics down to 0.5 mm pitch with type 3 powder. The paste maintains its activity and printing characteristics for up to 8 hours without shear thinning and can tolerate printing pauses of up to 60 minutes with an effective first print down to 0.5 mm. The residues from AP-10 are light amber and clear from solder balls, and the flux residues are washable with alcohols and/or commercial cleaners.

Brand of Product：	TAMURA ELSOLD
Part#：	AP-10 More Part#
Product Category：	Solder Paste More
Application：	[ BGA ][ µBGA ][ OSP boards ] More
Data Type：	Supplier and Product Introduction More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：
Version Number：
Data Encoding：
Data Size：	413 KB

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