SOLDER PASTE SC BLF061 Water Soluble, Type ISO 1.2.3.C

PublishTime：2025-03-15

SOLDER CHEMISTRY SC BLF061 是一种专为无铅应用开发的焊膏，具有易清洗、高粘附力、耐湿性等优点。该焊膏基于水溶性松香，符合 J-STD-004 标准的 RE L0 类别，不含卤化物，是最佳水洗焊膏之一。它具有优异的坍塌阻力、无焊球、长网板寿命和高温稳定性，适用于混合电路和 SMT，特别是在高频领域。该焊膏符合 ISO、EN、IPC 和 MIL 标准的要求。

Brand of Product：	SOLDER CHEMISTRY
Part#：	SC BLF061 More Part#
Product Category：	Solder Paste More
Application：	[ Hybrid circuits ][ SMT ][ HF ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：
Version Number：
Data Encoding：
Data Size：	57 KB

Data section preview(2pages)

- The full preview is over,the data is 2 pages -

Download

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Integrated Circuits