SOLDER PASTE SC 111 is a high-tech surface mount technology (SMT) product, whose flux can be easily removed with water before and after welding. The product's development is based on the high requirements of customers in the field of SMD production (chips, bare chips, chip resistors, etc.), hybrid circuits, and SMT (especially in the HF area), as well as the strict requirements of DIN, SN, IPC, and MIL standards. SC 111 is a uniform mixture consisting of all necessary alloys and particle sizes of solder powder, as well as an organic flux based on water-soluble rosin, without amines and halogens. The flux meets the J-STD-005 RE L0 standard, making SC 111 one of the very good water-soluble solder pastes. In addition to excellent collapse resistance, no balling, long stencil life, and high temperature stability, the solder paste also has the following advantages: soft, leaving only water-soluble residues; fully moisture-resistant - for days! High viscosity, even after several hours; excellent printability; excellent welding results after welding, even after washing, with bright solder joints; very suitable for fine pitch applications.
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