TIM-GEL PAD Thermally Conductive Silicone Pad DATA SHEET
■DESCRIPTIONS
●TIM-GEL PAD is Soft, easily compressible thermal interface pad designed to meet industry’s rapidly growing need for interface material with high thermal conductivity and conformability for low stress applications.
●TIM-GEL PAD is designed with flame retardant silicone polymer filled with thermally conductive fillers for a wide range of applications. It will provide superb protection against damage due to deformation as well as shock or vibration.
■KEY FUTURES AND BENEFITS
●Thermal Conductivity (1.6 W/m-k)
●Low Hardness, Naturally Tacky
●Soft, easily compressible
●low stress on component
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Thermally Conductive Silicone Pad 、 Soft, easily compressible thermal interface pad |
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[ semiconductors ][ Graphic chips ][ heat sinks ][ Industrial controls units ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/2/20 |
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155 KB |
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