TIM-GAP 1128 Thermally Conductive Silicone Gap Filler DATA SHEET
■DESCRIPTIONS
●TIM-GAP 1128 is Soft, thermal interface gap filler pad designed to meet industry’s rapidly growing need for interface material with high thermal conductivity and conformability for low stress applications.
●TIM-GAP 1128 is designed with flame retardant silicone polymer filled with thermally conductive fillers for a wide range of applications. It will provide superb protection against damage due to deformation as well as shock or vibration.
■KEY FUTURES AND BENEFITS
●High Thermal Conductivity (2.8 W/m-k)
●Cost-Effective Solution
●Soft, low stress on component
●Clean and easy to apply
|
Thermally Conductive Silicone Gap Filler 、 Soft, thermal interface gap filler pad |
|
|
[ semiconductors ][ Graphic chips ][ heat sinks ][ Mass storage drives ] |
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
2018/2/20 |
|
|
|
|
|
|
|
|
162 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
