TIM-GAP 1113 Thermally Conductive Silicone Gap Filler DATA SHEET
■DESCRIPTIONS
●TIM-GAP 1113 is Very Soft, easily compressible with bounce back property. Thermal interface gap filler pad designed to meet industry’s rapidly growing need for interface material with high thermal conductivity and conformability for low stress applications.
●TIM-GAP 1113 is designed with flame retardant silicone polymer filled with thermally conductive fillers for a wide range of applications. It will provide superb protection against damage due to deformation as well as shock or vibration.
■KEY FUTURES AND BENEFITS
●Thermal Conductivity (1.3 W/m-k)
●Cost-Effective Solution
●Highly Conformable, low stress on component
●Shock absorbing Characteristics
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Thermally Conductive Silicone Gap Filler 、 Thermal interface gap filler pad |
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[ semiconductors ][ Graphic chips ][ heat sinks ][ Mass storage drives ][ Power conversion ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2018/2/20 |
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162 KB |
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