PCIe® Gen 4 NVMe M.2 2280 SSD The Global Leader in Specialized Storage and Memory Solutions
2024-03-18
●ATP NVMe™ M.2 2280 SSDs with the PCI Express® (PCIe®) Gen 4 x4 interface meet the growing need for high-speed data transfer in today’s demanding applications.
●Up to 3.84 TB capacity, support for I-Temp (40°C to 85°C: N651Si) or C-Temp (0℃ to 70℃: N601Sc) operation, plus AES 256-bit encryption and TCG Opal 2.0 security make these SSDs ideal for read/write-intensive mission-critical applications, such as data logging, surveillance, and imaging systems.
●With twice the bandwidth of the previous generation (8 GT/s), PCIe Gen 4’s 16 GT/s data rate translates to a bandwidth of 2 GB/s for every PCIe lane, enabling these SSDs to transfer data faster. ATP’s PCIe Gen 4 SSDs use x4 lanes for a maximum bandwidth of 8 GB/s.
●Thermal management options for optimal heat dissipation include a nickel-coated copper heat spreader on controller and a 4 mm or 8 mm fin-type heatsink design.
●Key Features
■Superior Read/Write performance
■MCU-based Power Loss Protection Design with Level 4 (data-in-flight) protection
■Self-Encrypting Drive (SED) with AES 256-bit Encryption, TCG Opal 2.0
■Thermal Heatsink Solutions
■End-to-End Data Path Protection
■Anti-sulfuric resistor support
●Up to 3.84 TB capacity, support for I-Temp (40°C to 85°C: N651Si) or C-Temp (0℃ to 70℃: N601Sc) operation, plus AES 256-bit encryption and TCG Opal 2.0 security make these SSDs ideal for read/write-intensive mission-critical applications, such as data logging, surveillance, and imaging systems.
●With twice the bandwidth of the previous generation (8 GT/s), PCIe Gen 4’s 16 GT/s data rate translates to a bandwidth of 2 GB/s for every PCIe lane, enabling these SSDs to transfer data faster. ATP’s PCIe Gen 4 SSDs use x4 lanes for a maximum bandwidth of 8 GB/s.
●Thermal management options for optimal heat dissipation include a nickel-coated copper heat spreader on controller and a 4 mm or 8 mm fin-type heatsink design.
●Key Features
■Superior Read/Write performance
■MCU-based Power Loss Protection Design with Level 4 (data-in-flight) protection
■Self-Encrypting Drive (SED) with AES 256-bit Encryption, TCG Opal 2.0
■Thermal Heatsink Solutions
■End-to-End Data Path Protection
■Anti-sulfuric resistor support
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