ZGM230S Z-Wave 800 SiP Module Data Sheet
●Based on the EFR32ZG23 SoC, it delivers robust RF performance, long-range, industry-leading security features, low-current consumption, a rich set of MCU peripherals, and ample memory, all in a 6.5 x 6.5 mm package.
●The ZGM230S is a complete solution supported by powerful and fully-upgradeable software, advanced development and debugging tools, and documentation that will simplify and minimize the development cycle, certification process, and deployment of your end-product, helping to accelerate its time-to-market significantly.
●KEY FEATURES
■Z-Wave connectivity
■RF pin for external antenna
■+14 dBm TX power
■-109.8 dBm RX sensitivity @100 kbps
■32-bit ARM Cortex-M33 core at 39 MHz
■512/64 kB of Flash/RAM memory
■Advanced security features
■Rich set of MCU peripherals
■Integrated DC-DC converter
■34 GPIO pins
■-40 to 85 °C
■6.5 mm x 6.5 mm
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ZGM230S 、 ZGM230SA27HGN3 、 ZGM230SB27HGN3 、 ZGM230-RB4205B 、 ZGM230SB 、 ZGM230SA |
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Z-Wave 800 SiP module 、 radio boards 、 system-in-package (SiP) module |
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[ Smart Home ][ Security ][ Lighting ][ Building ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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July, 2022 |
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Rev. 1.0 |
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2.9 MB |
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