UG532: ZGM230S Dev Kit User's Guide

2022-09-23
■The ZGM230S Dev Kit is a low-cost, small form factor development and evaluation platform for the ZGM230S Z-Wave SiP Module (System-in-Package Module).
●The board is a small and cost-effective, feature-rich, prototype and development platform based on the ZGM230S Z-Wave System-in-Package Module. The ZGM230S Dev Kit is an ideal platform for developing energy-friendly connected IoT devices.
●A built-in SEGGER J-Link debugger ensures easy debugging through the USB Type-Cconnector.
■KIT FEATURES
●SMA connector for antenna connection
●Power control of on-board peripherals forultra-low power operation
●Relative humidity and temperature sensor
●Ambient light sensor
●Hall effect sensor
●6-axis inertial sensor
●LC sensor for metal detection
●Pressure sensor
●8 Mbit flash for OTA programming and data logging
●RGB LED, two single color LEDs, and two push buttons
●20-pin 2.54 mm breakout pads
●Qwiic® connector
●SEGGER J-Link on-board debugger
●Virtual COM port
●Packet Trace Interface (PTI)
●Mini Simplicity connector for AEM and packet trace using external Silicon Labs debugger
●USB or coin cell battery powered
●External battery connector

Silicon Labs

ZGM230SZGM230-DK2603AZGM230SB27HGN3BRD2603A

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Dev KitDev Kit boarddevelopment platform

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User's Guide

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English Chinese Chinese and English Japanese

June 2022

Rev. 1.0

UG532

3.1 MB

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