ZGM230S Z-Wave SiP Module Data Short

2021-10-15
◆The ZGM230S is a system-in-package (SiP) module for Z-Wave connectivity and networking built for the performance, security, and energy demands of the Smart Home.
◆Based on the EFR32ZG23 SoC, it delivers robust RF performance, long-range, industry-leading security features, low-current consumption, a rich set of MCU peripherals, ample memory, and a wide operating temperature range, all in a 6.5 x 6.5 mm package.
◆The ZGM230S is a complete solution supported by powerful and fully-upgradeable soft-ware, advanced development and debugging tools, and documentation that will simplify and minimize the development cycle, certification process, and deployment of your end-product, helping to accelerate its time-to-market significantly
◆KEY FEATURES
■Z-Wave connectivity
■RF pin for external antenna
■+14 dBm TX power
■-110.9 dBm RX sensitivity @100 kbps
■32-bit ARM Cortex-M33 core at 39 MHz
■512/64 kB of Flash/RAM memory
■Advanced security features
■Rich set of MCU peripherals
■Integrated DC-DC converter
■Up to 34 GPIO pins
■-40 to 85 °C
■6.5 mm x 6.5 mm

Silicon Labs

ZGM230SA27HGN2ZGM230SB27HGN2ZGM230S

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Part#

Z-Wave SiP Modulesystem-in-package (SiP) module

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Smart Home ]Security ]Lighting ]Building Automation ]

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Datasheet

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Please see the document for details

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2021/09/21

Rev. 0.4

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