EPC23101 – ePower™ Chipset

PublishTime：2022-08-12

■EPC’s ePower™ Stage and Chipset integrate input logic interface, level shifting, bootstrap charging and gate drive buffer circuits along with eGaN output FETs. Integration is implemented using EPC’s proprietary GaN IC technology. The end result is a Power Stage that translates logic level input to high voltage and high current power output that is smaller in size, easier to manufacture, simpler to design and more efficient to operate.
■Applications
●Buck, Boost, Half-Bridge, Full Bridge or LLC Converters
●Single-Phase and Three-Phase Motor Drive Inverter
■Features
●Integrated high side eGaN® FET with internal gate driver and level shifter
●Gate driver output to drive external low side eGaN FET
●5 V external bias supply
●3.3 V or 5 V CMOS input logic levels
●Independent high side and low side control inputs
●Cross conduction lockout logic keeps both FETs off when logic inputs are both high at same time
●External resistors to tune SW switching times and over-voltage spikes above rail and below ground
●Robust level shifter operating for hard and soft switching conditions
●False trigger immunity from fast switching transients
●Synchronous charging for high side bootstrap supply
●Low quiescent current mode from external VDRV supply when VDD Disable Input pin is pulled up
●Undervoltage lockout for internal low side and high side bias supplies
●Active gate pull-down for HS FET and LS gate drive with loss of VDRV supply
Chipset of compatible high and low side devicesin QFN packages with optimized pinouts between the two devices

Brand of Product：	EPC
Part#：	EPC23101 、 EPC2302 More Part#
Product Category：	ePower™ Chipset More
Application：	[ Buck Converters ][ Boost Converters ][ Half-Bridge Converters ][ Full Bridge Converters ][ LLC Converters ][ Single-Phase Motor Drive Inverter ][ Three-Phase Motor Drive Inverter ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	12/14/2021
Version Number：	Revision 1
Data Encoding：
Data Size：	1.2 MB

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Integrated Circuits