A300 FOUPs Front opening unified pod platform with super microenvironment control A4
●We offer 25-capacity FOUPs for standard wafer processing and a 13-capacity format that is optimized for special applications including bonded and thin wafers. All configurations are easy to clean and maintain, provide proven long-term reliability, and are fully SEMI compliant.
●FEATURES & BENEFITS:
■25-or 13-capacity designs:Provide versatility in thin, standard, or thick wafer processing applications
■Optimized materials, such as Entegris moisture barrier (EBM):Provide wafer contact and microenvironment control, enabling leading-edge wafer Provide wafer contact and microenvironment control, enabling leading-edge wafer
■Optional ESD shell:Offers added wafer protection in environments prone to electrostatic charge accumulation
■Industry-proven door:Provide equipment interoperability and long life
■Integral wafer supports:Allow excellent wafer plane performance and reliable wafer access
■Advanced purge options available:Accommodate process requirements such as maximum gas dispersion or front/rear purge
Front opening unified pod 、 environmental wafer isolation pod |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2021/6/7 |
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1008 KB |
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