A300 FOUPs Front opening unified pod platform with super microenvironment control A4

2022-06-29
●Our A300 FOUP (front opening unified pod) is an environmental wafer isolation pod that provides superior protection from contamination. It is designed for automated or manual handling of 300 mm wafers. Integral wafer supports allow precise wafer plane performance and reliable wafer access. An optional, robust ESD shell provides added wafer protection in applications prone to electrostatic charge accumulation.
●We offer 25-capacity FOUPs for standard wafer processing and a 13-capacity format that is optimized for special applications including bonded and thin wafers. All configurations are easy to clean and maintain, provide proven long-term reliability, and are fully SEMI compliant.
●FEATURES & BENEFITS:
■25-or 13-capacity designs:Provide versatility in thin, standard, or thick wafer processing applications
■Optimized materials, such as Entegris moisture barrier (EBM):Provide wafer contact and microenvironment control, enabling leading-edge wafer Provide wafer contact and microenvironment control, enabling leading-edge wafer
■Optional ESD shell:Offers added wafer protection in environments prone to electrostatic charge accumulation
■Industry-proven door:Provide equipment interoperability and long life
■Integral wafer supports:Allow excellent wafer plane performance and reliable wafer access
■Advanced purge options available:Accommodate process requirements such as maximum gas dispersion or front/rear purge

Entegris

A300 FOUPsA300 FOUP

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Front opening unified podenvironmental wafer isolation pod

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2021/6/7

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