Spectra™ FOUPs:Front opening unified pod platform with superior microenvironment control

2022-10-24
The Spectra™ FOUP holds 300 mm wafers safely and securely while they are transported and transferred within the fab through hundreds of sophisticated process steps. Designed not only to address particles but to also minimize and control VOC, oxygen, and relative humidity (RH), our FOUPs provide superior microenvironment control, optimal automation integration, and low cost of ownership.
Hydrophobic materials of construction with clean carbon loading are designed for low moisture and low volatile absorption and desorption. Generous radii in part design and open wash slots in the FOUP door cover eliminate water or moisture traps, enabling effective cleaning and reducing drying cycle times.
Our Spectra FOUP meets all applicable SEMI® standards. The industry-proven door is designed for equipment interoperability and long life. Wafer supports are integral with the shell to give excellent wafer plane performance and reliable wafer access. The top robotic flange and bottom kenematic coupling ensure accurate equipment interfaces.
These advanced FOUPs create a sealed wafer environment that provides static protection, white-light shielding, and a considerable positive impact on device yield.

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Front opening unified pod platform

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