GLPOLY XK-P25 Thermal Pad
●This series of products have the highest cost performance, soft and self-adhesive products; Good resilience , high deformation and high reliability
■Key Features:
●High thermal conductivity 2.5W/mk
●Low thermal resistance
●Conformable, low hardness
●Good electrical insulation
|
[ Automotive electronics ][ Digital disk drives ][ Telecommunications Industrial ][ medical equipment ] |
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
2022 |
|
|
Version 3 |
|
|
|
|
|
374 KB |
- +1 Like
- Add to Favorites
Recommend
- High-Performance Thermal Gap Filler Pads to Further Optimise Heat Transfer Applications in Electronic Systems
- Laird Releases Tflex™ Sf10 Series, a Silicone-free Gap Filler Delivering 10 W/mk Thermal Conductivity
- Why Does Thermal Resistance Affect the Thermal Conductivity of Thermal Silicone Pad?
- New THERM-A-GAP GEL 75 Thermal Gel Offers High Thermal Conductivity and Reliability
- A Brief Description of Thermally Conductive Materials - Thermally Conductive Gel
- What Does the Thermal Resistance of Thermal Conductive Materials Affect?
- Why Use a Thermal Interface Material with High Thermal Conductivity?
- What Are the Factors that Affect the Thermal Conductivity of Thermal Pad?
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
