GLPOLY XK-P50 Thermal Pad
●This series of products are resilient and with large deformation, suitable for large institutional design tolerances. Single or double layer structure, the double layer is reinforced with special ultra-thin-fabric to increase resistance and work-ability of puncture, strip type,malformation designs. Self-adhesive and never recede. No corrosion to the copper surface, "Environmentally friendly products".
■Key Features:
●High thermal conductivity 5.0W/mk
●Low thermal resistance low hardness
●Good electrical insulation
●Ultra conformable,"gel-like" modulus
●Designed for low-stress applications
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[ Automotive electronics ][ Telecommunications ][ Computer ][ Between heat-generating ][ semiconductor ][ a heat sink ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2022 |
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Version 3 |
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383 KB |
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