MS150-T1130-01 H1.50 Micro SIM BOOTH CONNECTOR
●Material :
◆Insulator : High Temperature Thermoplastic, UL—94V—0
◆Contect : Copper Alloy
◆Shield Shell : Stainless Steel
●Plating :
◆Contect : Plsted 50μ”Ni overall, Contect Area 1μ" Au
◆Shield Shell : Plsted 30μ" min. Solderability Ni overall
●Electrical :
◆Current Rating : 0.5A
◆Coltage Rating : 30V AC/DC
◆Ambient Temperature Range : -20 C~+85 C
◆Storage Temperature Range : -50 C~ + 100 C
◆Ambient Humidity Range : 95% R.H. Max.
◆Contect Resistance : 100mΩ Max.
◆Insulation Resistance : 1000MΩ Min. /500V DC
◆Mating Cycles : 3000Min Insertions
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Product Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2019.06.01 |
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REV.: A |
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D-MS150-T1130-01 |
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168 KB |
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