MS150-T1130-01 Micro SIM H1.50
■Material :
▲Insulator: High Temperature Thermoplastic, UL-94V-0
▲Contect: Copper Alloy
▲Shield Shell : Stainless Steel
■Plating:
▲Contect: Plsted 50u" Ni overall, Contect Area 1u" Au
▲Shield Shell: Plsted 30u" min. Solderability Ni overall
■Electrical:
▲Current Rating: 0.5A
▲Voltage Rating: 30V AC/DC
▲Ambient Temperature Range: -20℃~+85℃
▲Storage Temperature Range: -50℃~+100℃
▲Ambient Humidity Range: 95% R.H. Max.
▲Contect Resistance: 100mΩ Max.
▲Insulation Resistance: 1000MΩ Min. /500V DC
▲Mating Cycles: 3000Min Insertions
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Product Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2019.06.01 |
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REV.: A |
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D-MS150-T1130-01 |
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174 KB |
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