TC350™ Plus Laminates
●The standard TC350 Plus laminates are offered with a smooth (Rq = 1.0μm) electrodeposited copper foil cladding to reduce insertion loss and RF heating of conductors within the circuit. Resistive foil and metal plate options are available upon request. TC350 Plus laminates are available in thicknesses from 0.010” to 0.060” to address higher power design needs.
●The woven glass reinforcement combined with the high filler content of the laminate affords excellent dimensional stability. Other key features of the laminate include low z-axis CTE (38ppm/°C) for excellent plated through hole reliability, low loss tangent of 0.0017 at 10 GHz to enable low loss designs, low moisture absorption of 0.05% to ensure stable performance in a range of operating environments, high dielectric strength of 650 V/mil to ensure good z-axis insulation between conductor layers, and UL 94 V-0 flammability performance to enable the use of the material in commercial applications.
●Features and Benefits:
■High Thermal Conductivity of 1.24 W/(m.K)
▲Improved Thermal Dissipation Enabling Lower Operating Temperatures for High Power Applications
■Low Loss Tangent of 0.0017 at 10 GHz
▲Excellent High Frequency Performance
■Very Low Profile and Thermally Stable ED Copper Foil (Rq = 1.0 μm)
• Very Low Insertion Loss and Reduced RF Heat Generation of Conductors
■Advanced Filler Systems
▲Improved Drilling Performance When Compared to Competitive Materials
[ Amplifiers ][ Combiners ][ Power Dividers ][ Couplers ][ Filters ][ Commercial application ][ Consumer application ][ Defense ][ Aerospace ][ High Power RF Amplifiers ][ Microwave Power Amplifiers ][ Industrial Heating Applications ][ Passive Components ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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072321 |
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Issued 1519 |
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# 92-191 |
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208 KB |
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