TC350™ Plus Laminates
The standard TC350 Plus laminates are offered with a smooth (Rq = 1.0µm) electrodeposited copper foil cladding to reduce insertion loss and RF heating of conductors within the circuit. Resistive foil and metal plate options are available upon request. TC350 Plus laminates are available in thicknesses from 0.010” to 0.060” to address higher power design needs.
The woven glass reinforcement combined with the high filler content of the laminate affords excellent dimensional stability. Other key features of the laminate include low z-axis CTE (38ppm/°C) for excellent plated through hole reliability, low loss tangent of 0.0017 at 10 GHz to enable low loss designs, low moisture absorption of 0.05% to ensure stable performance in a range of operating environments, high dielectric strength of 650 V/mil to ensure good z-axis insulation between conductor layers, and UL 94 V-0 flammability performance to enable the use of the material in commercial applications.
TC350 Plus laminates are used in a range of applications including Amplifiers, Combiners, Power Dividers, Couplers, and Filters. Applicable markets range from Commercial and Consumer to Defense and Aerospace.
[ High Power RF and Microwave Power Amplifiers ][ High Power Amplifiers for Industrial Heating Applications ][ Passive Components such as Couplers, Filters and Power Dividers ] |
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Datasheet |
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UL 94 V-0 |
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Please see the document for details |
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