Handling Instructions for flow E1/E2 packages

PublishTime：2020-07-15

The electrical connections between flowE type modules and PCB can be made by soldering or Press-fit technology. In applications where the module is attached to a heat sink, the PCB must also be attached to this heat sink.
During assembly the pins are not to be drawn or pushed more than ±0.15mm or pulled with an overall force greater than 35 N. Using soldered connection the overall compressing force could be 2 times higher on the pins than the pulling force. For Press-fit assembly the maximum compression force is defined by the press-in force, maximum 100 N for every single pin,see section 7.2.Additionally, the special design of the Press-fit pins prevents higher than 0.15 mm compression of pins.
The tension of any single pin must not exceed ±5 N at a maximum substrate temperature of 100°C.
The recommended assembly sequence:
1.Attach the module to the PCB with soldering or Press-fit technology
2.Position and fix the assembled PCB with spacers to the heat sink
3.Fix the module to the heat sink

Brand of Product：	Vincotech
Part#：
Product Category：	flowE1/E2 modules More
Application：	More
Data Type：	User's Guide More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	15.05.2020
Version Number：	REV.12
Data Encoding：
Data Size：	1.9 MB

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