GN002 Thermal Design for GaN Systems’ Top-side cooled GaNPX®-T packaged devices Application Note
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SIL-PAD K-4 、 SIL-PAD 1500ST 、 GAP3000S30 、 HI -FLOW 300P 、 GS 3500S35-07 、 GS66508T 、 GS66516T 、 GS66506T 、 GS61008T |
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Application note & Design Guide |
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Please see the document for details |
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GaNPX®-T;SMD;TO-220;GaNPX® |
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English Chinese Chinese and English Japanese |
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October 30, 2018 |
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GN002 |
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1.7 MB |
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