GaN Systems – 1

GN002 Application Note

Thermal Design for GaN Systems’ Top-side cooled GaNPX®-T packaged devices

October 30, 2018

GaN Systems – 2

Application Note Outline

• The Basics - Our top side cooled GaNPX®-T package

• Thermal Design for high-power with GaNPX®-T package

• Heatsink Mounting Design Considerations

• Bending Pressure and Deformation Limits