THERMATTACH®T413 and T414 Thermally Conductive Adhesive Tapesfor Heat Spreader to Circuit Board Attachment
Chomerics’ patented* THERMATTACH® T413 and T414 double-sided adhesive tapes provide an effective thermal interface between components, ceramic hybrid circuits, printed circuit boards,flexible circuits and heat spreaders and sinks. Both are ionically clean tapes with good thermal conductivity and exceptional bonding properties – eliminating the need for thermal grease and mechanical fasteners.
THERMATTACH T413 thermal tape consists of a high bond strength, pressure-sensitive acrylic adhesive filled with aluminum oxide applied to a fiberglass carrier. The adhesive thickness and fiber-glass allow for good conformability to irregular surfaces and good electrical isolation.
THERMATTACH T414 thermal tape consists of a high bond strength, pressure-sensitive acrylic adhesive, loaded with aluminum oxide particles and coated on 0.001 in. (0.025 mm) Kapton MT** thermally conductive polyimide film. The tape provides good thermal performance and excellent electrical isolation.
THERMATTACH tapes are embossed with a unique pattern for maximum conformability and minimal air pockets. Extensive testing has shown that Chomerics’ embossing system provides thermal and mechanical results superior to those of flat thermal tapes.
All THERMATTACH tapes meet stringent thermal, mechanical,environmental and chemical requirements. Vibration testing at 10 G shows no adverse effects.Unlike traditional acrylic pressure-sensitive tapes, after extended temperature/humidity aging and harsh conditions, THERMATTACH tapes meet or exceed initial properties for shear strength and thermal conductivity.
T413 、 T414 、 67-10-YYYY 、 ZZZZ |
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[ heat sink ] |
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2M1299AG-229 |
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107 KB |
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