DESCRIPTION
Chomerics’ patented* THERMATTACH
®
T413 and T414 double-sided adhesive
tapes provide an effective thermal
interface between components, ceramic
hybrid circuits, printed circuit boards,
flexible circuits and heat spreaders and
sinks. Both are ionically clean tapes with
good thermal conductivity and exceptional
bonding properties – eliminating the
need for thermal grease and mechanical
fasteners.
THERMATTACH T413 thermal tape
consists of a high bond strength, pressure-
sensitive acrylic adhesive filled with
aluminum oxide applied to a fiberglass
carrier. The adhesive thickness and fiber-
glass allow for good conformability to
irregular surfaces and good electrical
isolation.
THERMATTACH T414 thermal tape
consists of a high bond strength, pressure-
sensitive acrylic adhesive, loaded with
aluminum oxide particles and coated on
0.001 in. (0.025 mm) Kapton MT** ther-
mally conductive polyimide film. The tape
provides good thermal performance
and excellent electrical isolation.
THERMATTACH tapes are embossed
with a unique pattern for maximum
conformability and minimal air
pockets. Extensive testing has
shown that Chomerics’ emboss-
ing system provides thermal and
mechanical results superior to
those of flat thermal tapes.
All THERMATTACH tapes meet
stringent thermal, mechanical,
environmental and chemical
requirements. Vibration testing at
10 G shows no adverse effects.
Unlike traditional acrylic pressure-
sensitive tapes, after extended
temperature/humidity aging and
harsh conditions, THERMATTACH
tapes meet or exceed initial
properties for shear strength
and thermal conductivity.
APPLICATIONS
For heat sink attachment to plastic
encapsulated components, such as
BGAs, THERMATTACH T410 and 411
tapes are recommended. Please see
Chomerics Technical Bulletin No.79
for more information.
THERMATTACH T413 thermal tape bonds
copper heat spreaders to the bottom of
printed circuit boards to allow heat dissi-
pation through the thermal vias under
components. The tape also bonds heat
spreaders/stiffeners to flex circuits in
microprocessor TAB package construc-
tions as well as ceramic hybrid circuits to
metal chassis walls in place of clips,
screws or other mechanical fasteners with-
out thermal compounds.
THERMATTACH T413 tape has many
advantages over traditional adhesives
and mechanical fasteners. It can be
consistently applied to meet design level
thermal and mechanical requirements.
Unlike rigid adhesives, THERMATTACH
T413 is pliable and conformable,
reducing concerns over CTE mismatch
and the cracking or splitting of components
or epoxy bond lines. At very comparable
installed costs, THERMATTACH T413
offers advantages over mechanical
fasteners or liquid adhesives which
may require a large capital investment.
APPLICATION INSTRUCTIONS
Materials needed:
Clean cotton cloth
or rag, industrial solvent, rubber gloves.
For optimal performance, Chomerics
recommends interface flatness of
0.002 in/in (0.05 mm/mm) max. for T413
and 0.001 in/in (0.025 mm/mm) max. for
T414.
Step 1:
Ensure that bonding surfaces
are free from oil, dust, etc. Using rubber
gloves, wipe surfaces with a cloth
dampened with industrial solvents such
as MEK, toluene, acetone or isopropyl
alcohol.
Step 2:
Cut tape to size and remove
clear liner or remove pre-cut tape from roll.
Step 3:
Apply device and smooth over
entire surface using moderate pressure.
Step 4:
Remove blue embossed liner
from the tape. Center device using any
one of the recommended temperature/
pressure options shown below:
Contact Chomerics’ Applications
Department for additional information.
Note:
Increasing any of the application
variables (pressure, temperature and
time) can improve results due to the
relationship of the variables. Elevated
temperature can be achieved by exposing
heat sinks to a conventional hot air/heat
gun prior to application. Approximately
70% of the ultimate adhesive bond
strength is achieved with initial application,
and 80-90% is reached within 15 minutes.
Ultimate adhesive strength is achieved
within 36 hours; however, the next manu-
facturing step can occur immediately
following the initial application.
THERMATTACH
®
T413 and T414
Thermally Conductive Adhesive Tapes
for Heat Spreader to Circuit Board Attachment
continued
* U.S. Patent #5,298,791
** Trademark of DuPont
Pressure Temperature Time
10 psi
(0.069 MPa)
22°C 15 sec.
30 psi
(0.207 MPa)
22°C 5 sec.
10 psi
(0.069 MPa)
50-65°C 5 sec.
30 psi
(0.207 MPa)
50-65°C 3 sec.
TECHNICAL
BULLETIN
• Phase-change thermal interface materials
• Thermally conductive adhesive tapes
• Thermally conductive insulator pads
• Thermally conductive gap fillers
• Thermally conductive silicone compounds
• Flexible heat spreaders • Thermal management for BGAs
LEADER IN THERMAL MANAGEMENT: DESIGN, INNOVATION AND MATERIALS
67
TYPICAL PROPERTIES T413 T414 TEST METHOD
Carrier Fiberglass Kapton MT** ––
Color White Beige Visual
Thickness, inch 0.007 (0.178) 0.005 (0.127) ASTM D374
Thermal Impedance @ <1 psi,
0.65 (4.0) 0.6 (3.7) ASTM D5470
°C-in
2
/W (°C-cm
2
/W)
Thermal Conductivity, W/m-K 0.35 0.37 ASTM D5470
Voltage Breakdown, Vac 3700 5000 ASTM D149
Volume Resistivity, ohm-cm 1.3 x 10
16
5 x 10
15
ASTM D257
Lap Shear Adhesion, psi (MPa) 100 (0.69) 100 (0.69) ASTM D1002
Die Shear Adhesion, psi (MPa) Chomerics
Aluminum 25°C 180 (1.24) 150 (1.04) Test Procedure
150°C 20 (0.138) 15 (0.104) No. 54
Creep Adhesion, days
25°C, 12 psi (0.083 MPa) >50 >50 PSTC-7***
150°C, 12 psi (0.083 MPa) >10 >10
Adhesive CTE, ppm/°C, –40 to +150°C 147 147 ASTM D3386
THERMATTACH
®
T413 and T414 Thermally Conductive Adhesive Tapes
continued
67 – 10 – YYYY – ZZZZ
Roll Width
0050 = 0.50 in. (1.27 cm)
0075 = 0.75 in. (1.91 cm)
0100 = 1.00 in. (2.54 cm)
0125 = 1.25 in. (3.18 cm)
0150 = 1.50 in. (3.81 cm)
0175 = 1.75 in. (4.45 cm)
0200 = 2.00 in. (5.08 cm)
Material
T413 = THERMATTACH 413
T414 = THERMATTACH 414
** Trademark of DuPont *** Pressure Sensitive Tape Council
CONSTR.
THERMAL
ELEC.
MECHANICAL
REMOVAL INSTRUCTIONS
Materials needed:
Single-edged razor
blade or a small, thin-bladed pocket
knife; soft, thin metal spatula. Use safe-
ty precautions when handling sharp
instruments and organic solvents.
Step 1:
Carefully insert the blade
edge into the bond line at a corner
between the device and the bonding
surface. The penetration need not be
very deep.
Step 2:
Remove the blade and
insert the spatula into the wedge.
Slowly twist the spatula blade so that
it exerts a slight upward pressure.
Step 3:
As the two surfaces start
to separate, move the spatula blade
deeper into the bond line and continue
the twisting motion and upward force.
Step 4:
After the device is separat-
ed, the tape can be removed and dis-
carded. If adhesive remains on the
surfaces, it must be removed. Adhesive
is best removed by wiping with a rag
dabbed with isopropyl alcohol, MEK or
toluene. Use sufficient solvent to
remove all adhesive.
Step 5:
Let solvent cleaned compo-
nents air dry for 15 minutes before
reapplying THERMATTACH tape.
ORDERING INFORMATION
Standard Rolls
THERMATTACH T413 and T414
thermal tapes are available in standard
100 ft. (30.5m) rolls of various widths.
Use the part number system below when
ordering rolls of THERMATTACH tapes.
Pre-cut parts are available in kiss-cut,
rectangular shapes on rolls of 1000 parts
per roll. For availability of THERMATTACH
parts for other components or package
sizes, please contact Chomerics’ Inside
Sales Department.
Chomerics,
Div. of Parker Hannifin
77 Dragon Court
Woburn, MA 01888-4014
TEL: 781-935-4850
FAX: 781-933-4318
Parker Hannifin PLC
Chomerics Europe
Parkway, Globe Park
Marlow, Bucks, SL7 1YB, United Kingdom
TEL: (44) 1628 404000 FAX: (44) 1628 404090
France Freephone TEL: (0590) 8170
Germany Freephone TEL: (0130) 818074
9001
CERTIFIED
9002
CERTIFIED
NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without
guarantee or responsibility on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness
for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated on Chomerics’ invoice, quotation, or order acknowledgement. We disclaim any and all
liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any
process or to manufacture or to use any product in conflict with existing or future patents covering any product or material or its use.
© Chomerics, div. of Parker Hannifin Corp., 1999
Printed in U.S.A.
Parker Hannifin Hong Kong Ltd.
Chomerics Sales Department
8/F King Yip Plaza
9 Cheung Yee Street, Cheung Sha Wan
Kowloon, Hong Kong
TEL: (852) 2 428 8008
FAX: (852) 2 423 8253
www.chomerics.com
2M1299AG-229