Smiths Interconnect NXS Series, New Ultra-High Density, Space Qualified Interconnect
Smiths Interconnect announced today the release of its new NXS Series, the ultra-high density interconnect specifically designed and tested for critical space flight applications.
Today, space satellites are moving away from RF Analog-based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. This architecture increases the demand for rugged and higher speed connectivity. NXS forms the interconnect backplane that enables a scalable satellite design using as many or as few “modular digital processors” as required, at the same time ensuring signal integrity, and high resistance to shock.
“Satellite manufacturers often use large singular printed circuit boards featuring very high value components. The NXS Series provides them with a solderless PCB mounted connector that can be placed and replaced with very low risk to their board“ said Mark Kelleher, Vice President and General Manager of the Connector Business Unit at Smiths Interconnect. “The new NXS Series is designed to offer an advanced, high density interconnect that is more compact than those currently available in the marketplace, providing next generation data on demand” he added.
The new NXS Series is built to the highest space standards and qualified to rigorous testing and performance criteria: ESCC 3401, ESCC 3402, ECSS-Q-ST-70C, ECSS-Q-ST-70-02, ECSS-Q-ST-70-08C, ECSS-Q-ST-70-38C and ECSS-Q-70-71.
Equipped with the micro Hypertac® Hyperboloid contact technology, the NXS Series can withstand data rate application up to 10 Gbps requirements per channel, including extreme levels of vibration, shock and climatic testing above 2100G.
The NXS Series comes in a robust design/construction with 4 or 12 high speed quadrax (dual-twinax) modules. Each ultra-high density quadrax module contains 2 dual twinax at 100 Ω each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials.
In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components. Each product is engineered using 3D Electromagnetic Simulation (EM) software to provide excellent performance in a total thin film process.
- 【Datasheet】NXS Series Ultra-High Density, Space Qualified Interconnect
- 【Datasheet】NXS Series Technical Characteristics
- 【Datasheet】NXS Series Ultra-High Density, Space Qualified Interconnect
- 【Datasheet】NXS Series Ultra-High Density, Space Qualified Interconnect
- 【Datasheet】NXS Series Ultra-High Density, Space Qualified Interconnect
- 【Datasheet】NXS Series Ultra-High Density, Space Qualified Interconnect
- +1 Like
- Add to Favorites
Recommend
- Smiths Interconnect Offered Isolators to Support NASA’s Europa Clipper Mission to Explore Jupiter’s Moon
- New EMI Flange for Smiths Interconnect‘s NXS Connectors Ensures the Elimination of Unwanted RF or HRF Noise Line Signals and Improves System Performance
- Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards
- Smiths Interconnect Acquires Reflex Photonics to Expand in High Speed Data Transmission Market
- How Smiths Interconnect Keeps The Medical World Connected
- Smiths Interconnect Connector NXS Series Meet the Increasing Demand for Rugged, High-speed Connections in Space Applications
- Smiths Interconnect Wins Elektra Awards for Excellence in Product Design- High Reliability Systems Category
- Smiths Interconnect Expands into Burn-In Test Market with Acquisition of Plastronics
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
