NXS Series Ultra-High Density, Space Qualified Interconnect
●Today, space satellites are moving away from RF Analog based payloads providing low speed telecommunication signaling, to a new Digital Transparent Processor architecture for high throughput satellites. Those architectures increase the demand for rugged and higher speed connectivity.
●Features
■Low outgassing materials
■Hyperboloid contact technology
■Solderless PCB Termination
■4 and 12 bay configurations
●Benefits
■Weight savings
■Ultra high contact density
■Ultra low mating force
■Withstands high shock and vibration space environments
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NXS Series 、 NXS 、 HXS-0060-107 、 HXS-0021-M 、 HXS-7009 、 HYP-7049-H-117 、 HHSC-0156-100 、 HYP-6944-M 、 HXS-0065 |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2021 |
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Version1.2 |
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1.7 MB |
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