Smiths Interconnect‘ s New Fixed Chip Attenuators AT Series Offer Proven High Performance in Commercial Applications
Smiths Interconnect announces the launch of its new AT Series of RF chip attenuators from DC to 20 GHz. RF chip attenuators are components used in communication systems to reduce the strength of a signal passing through it. They play a crucial role in protecting systems from receiving a signal with a power level that is too high to process. The range being introduced from Smiths Interconnect is significant because it offers a high frequency of DC to 20 GHz which is required for use in key commercial and space applications.
“The single-chip design of the AT Series replaces an array of resistors, saving valuable board space and allowing an easy installation in the customer's circuit”, said Tullio Panarello, VP and General Manager of the Fibre Optics and RF Components Business Unit at Smiths Interconnect. “The customer’s cost of ownership is decreased by reducing the bill of material and eliminating tuning of the circuit while adding more reliability”, he added.
The AT Series fixed chip attenuator is available in various styles from DC-6 GHz for lower frequency requirements up to DC-20 GHz for the broadband requirements of higher frequency commercial high-volume applications. It provides excellent attenuation accuracy and flatness by maintaining an efficient RF power transmission. It offers a proven, robust, thick film construction in a cost-effective, easy-to-implement solution.
The chip attenuators come already fine-tuned to meet performance specifications, eliminating any fine-tuning, or reworking that would have to be done by the customer.
Smiths Interconnect’s AT Series of chip attenuators offer the following features:
●Thick film process technology on an alumina substrate
●Surface mount configuration
●High-volume delivery on tape and reel
●Compact and lightweight
●Repeatable VSWR
●RoHS compliance
- +1 Like
- Add to Favorites
Recommend
- Smiths Interconnect Offered Isolators to Support NASA’s Europa Clipper Mission to Explore Jupiter’s Moon
- Smiths Interconnect’s DaVinci 112 High-Speed Test Socket Wins Best Test Measurement Award at the 2024 Global Electronics Achievement Awards
- Smiths Interconnect Acquires Reflex Photonics to Expand in High Speed Data Transmission Market
- How Smiths Interconnect Keeps The Medical World Connected
- Smiths Interconnect Expands into Burn-In Test Market with Acquisition of Plastronics
- Smiths Interconnect Hypertac Green Connect: A Game-changer in the Battery Electric Vehicles Industry
- Smiths Interconnect New Hypertac Green Connect Contact Technology is Designed to Reduce Power Loss
- Smiths Interconnect Expanded RF Filter Capability for European and Asian Markets
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
