Runic Technology Launches Eleven Automotive-qualified ICs Meeting AEC-Q100 Grade 1 and MSL1

PublishTime： 2022-12-28 Article Source：RUN-IC News

Runic launched four classification total of eleven products meeting AEC-Q100 grade 1 and MSL1.

●Amplifiers : RS8557XF-Q1、RS8452XK-Q1、RS8454XP-Q1

●Level converters: RS4T245XTQW16-Q1、RS1T45XC6-Q1、RS2T45VS8-Q1

●Logic ICs : RS1G14XC5-Q1、RS1G17XC5-Q1、RS1G32XF5-Q1

RUN-IC products were performed and passed on a series of reliability tests - accelerated environment stress tests accelerated lifetime Simulation tests, package assembly integrity tests, die fabrication reliability tests, electrical verification tests, and defect screening tests to meet AEC-Q100 qualification.

RS4T245XTQW16-Q designed for DHVQFN16 SWF（side-wettable flank）is the first IC in China to meet the automotive qualification.

Benefits of QNF packaging:

●Excellent thermal performance

●Small footprint (yields savings in PCB real estate)

●Thin package

The defects of QFN

There is no easily viewed for automotive application to solderable or exposed pins/terminals to determine whether or not the package successfully soldered onto the printed circuit board (PCB) for general QFN packaging; however, Runic ensures RS4T245XTQW16-Q quality using AuPdNi Etching dimple lead to fulfilling AOI visualization.

Fig.1

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