Sunlord Developed Mini Size and Ultra-high Q Wire Wound Chip Ceramic Inductor-MWSD0603C/0804C Series
The development of 5G technology, high-speed, low-latency, and wide-coverage networks has brought new opportunities and challenges to wireless communication devices. Especially in the RF front-end, with more frequency bands used in 5G smartphones, it requires lower loss of RF devices to improve the receiving sensitivity and anti-interference capability in each frequency band. On the other hand, smartphones are becoming thinner and thinner, leaving less space for components. So small size RF Inductors with higher Q values are needed.
At present, the mainstream size of the winding inductor used in smartphones is 1005 (1.0*1.0*0.5mm). If a 0603 (0.53*0.4*0.4mm) winding inductor with the same performance as 1005 is developed, it will further help reduce the size of high-end smartphones. Therefore, SUNLORD developed mini size and ultra-high Q wire wound chip ceramic inductor-MWSD0603C/0804C series to achieve this goal.
Features
●High Q value
●Winding structure, super small size
●High self-resonant frequency
●Low DCR, high current
Applications
●RF circuits for smartphones, smart wearable devices, etc.
●Various wireless communication modules such as Wi-Fi/Bluetooth.
Dimensions
Fig.1
Part Number
Fig.2
Electrical Characteristics
Table.1
Wire wound chip ceramic inductor MWSDO6O3C series has a higher value compared with multilayer chip ceramic inductor SDCLO6O3Q and HQO6O3H series
Fig.3
Fig.4
Production
Mass production
- 【Datasheet】MWSD0603C/0804C Series Mini Size and Ultra High Q Wire Wound Chip Ceramic Inductor
- 【Datasheet】MWSD-C Series Wire Wound Chip Ceramic Inductor
- 【Datasheet】MWSD-C Series Wire Wound Chip Ceramic Inductor
- 【Datasheet】Wire Wound Chip Ceramic Inductor - MWSD-C Series
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