Silicon Labs xG26 Sets New Standard in Multiprotocol Wireless Device Performance
 
                                         
                                       Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, today announced their new xG26 family of Wireless SoCs and MCUs, the IoT industry leader's highest performance device family to date. The new family consists of the multiprotocol MG26 SoC, the Bluetooth LE SoC BG26, and the PG26 MCU. All three are designed to future-proof the IoT against some of the most demanding emerging applications, like Matter, with double the Flash and RAM of other Silicon Labs multiprotocol devices.
"As users from consumer to industrial sectors extract more benefits from their IoT deployments, their requirements are steadily increasing," said Matt Johnson, CEO of Silicon Labs, Inc. "The new xG26 family is built for the future, empowering device manufacturers with the confidence that their current designs will meet tomorrow's demands."


To help designers build devices capable of running advanced IoT applications, the xG26 family can be equipped with:
- Doubled Flash, RAM, and GPIO capacity compared to the xG24 device family, allowing IoT device builders to develop advanced edge applications. It also has double the number of general-purpose input/output (GPIO) pins as the xG24, meaning that device builders can connect it to twice as many peripherals for better system integration. 
- Higher performance compute in a multicore format with an ARM® Cortex®-M33 CPU and dedicated cores for the radio and security subsystems, helping to free up the main core for customer applications. 
- Embedded AI/ML hardware acceleration, enabling up to 8x faster processing of machine learning algorithms using as little as 1/6th the power, achieving greater energy efficiency. 
- Best-in-Class Security with Silicon Labs Secure Vault™ and ARM TrustZone. Using the Silicon Labs Custom Part Manufacturing Service, xG26 devices can also be hard-coded with customer-designed security keys and other features in the fabrication process, further hardening them against vulnerabilities. 
- 2.4 GHz wireless connectivity leveraging Silicon Labs' proven, tested, and certified software stacks for 2.4 GHz wireless protocols, including Matter, Zigbee, OpenThread, Bluetooth Low Energy, Bluetooth Mesh, Proprietary, and Multiprotocol, with a best in class RF link budget that improves range and reduces transmission retries, providing a better user experience while improving battery life. 
MG26 Multiprotocol SoC Designed to be Most Advanced SoC for Matter over Thread
Silicon Labs is all-in on Matter, the rapidly deploying application layer that allows devices to be interoperable between the leading IoT networks and ecosystems. Silicon Labs is Matter's leading semiconductor code contributor and third-largest contributor. The experience gained from working on Matter gave Silicon Labs deep insight into what it takes to build a device capable of growing with the needs of the Matter standard as it adds support for new device types, security enhancements, and more. Most device types have already seen Matter's code requirements grow by 6% in the first 18 months since Matter 1.0 was released in October 2022.
Consumers who invest in building Matter-enabled Smart Homes don't want their new devices to become obsolete in a few years. Instead, they want confidence that the Matter device they purchased last year will work with the same devices and be as secure as the next Matter device they buy next year. That's Matter's interoperability and security promise, which is why Silicon Labs designed the MG26 to be the most advanced SoC for the Matter standard.
Building off the same platform as the award-winning MG24 Multiprotocol Wireless SoC, the MG26 doubles its predecessor's Flash and RAM capacity and can be configured with up to 3200 kB of Flash and 512 kB of RAM. It also has double the number of general-purpose input/output (GPIO) pins as the MG24, meaning that device builders can connect it to twice as many peripherals for better system integration.
To enable greater intelligence for not only Matter-enabled applications, but all applications, the MG26, BG26, and PG26 also use Silicon Labs' proprietary Matrix Vector AI/ML hardware accelerator. This dedicated core is optimized for machine learning and can process ML operations up to 8x faster using as little as 1/6th the energy as a traditional embedded CPU. This significantly improves the family's energy efficiency because the device can offload ML-based activation or wake cues to the accelerator, allowing more power-hungry functions to sleep and minimize battery drain. This is ideal for smart home battery-operated devices like sensors or switches, where consumers look for them to fade into the background of their home and not draw their attention with the need for constant battery changes.
Silicon Labs Extends IoT Leadership with New SoC and MCU Family
Silicon Labs is one of the world's leading pure-play IoT companies, and no other can match its breadth, depth, and expertise in the Internet of Things. That's why the xG26 launches as a family. While the MG26 is ideal for Matter, the BG26 Bluetooth SoC brings all the same features and is optimized for Bluetooth LE and Bluetooth Mesh, and the PG26 brings low-power intelligence to unconnected applications like CCTV cameras, remotes, and children's toys. Pin compatibility between select xG26 and xG24 devices and shared hardware and software development tools like Silicon Labs Simplicity Studios allows for easy development and seamless migration from other Silicon Labs Series 2 devices.
- +1 Like
- Add to Favorites
This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.
Recommend
Wireless SoCs target IoT
2025-09-02 - Product Introduction Silicon Labs launches its first Series 3 wireless SoCs, built on the 22-nm process node, targeting line-powered and battery-powered IoT devices.
The xG27 SoC Is Small (In Size) but Mighty for Connected Health Applications
2023-03-13 - Product Introduction Today, we’re excited to announce a new family of low-power SoCs that enables secure, energy-friendly multiprotocol wireless networking for IoT devices, the EFR32xG27, which includes the MG27, our multiprotocol SoC and the BG27, our Bluetooth LE SoC. The BG27 enables device makers to add high-performance and secure low-power Bluetooth LE on tiny form-factor devices, expanding the possibilities of smart connected medical devices and wearables.
BG29 is Here – Powering the Smallest and Smartest Bluetooth LE Devices
2025-07-22 - Product Introduction BG29 combines high compute, ultra-low power consumption, and an ultra-compact form factor. It has been engineered to meet the power and performance needs of modern IoT applications while fitting into the smallest spaces. This makes it ideal for devices where space is limited but expectations for efficiency and capability remain high.
Silicon Labs Redefines Smart Home Connectivity with New Concurrent Multiprotocol SoC
2025-03-10 - Manufacturer News Silicon Labs today announced that its MG26 family of wireless SoCs is now generally available through Silicon Labs and its distribution partners. As the industry‘s most advanced, high-performance Matter and concurrent multiprotocol solution to date, the MG26 SoC features double the Flash and RAM of other Silicon Labs multiprotocol devices, advanced AI/ML processing, and best-in-class security.
The New xG27 Wireless SoCs Bring Secure High-performance Mesh Networking at the Reach of Small Smart Home Devices
2023-03-21 - Application solution Article The Silicon Labs EFR32xG27 family of wireless SoCs is designed for battery-powered smart home IoT devices that, despite their small form factor and constrained resources, need high-performance wireless, high computing, large memory, and robust security. The Solution is the xG27 Wireless SoCs.
LEEDARSON Chooses Silicon Labs MG24 Wireless SoC and Matter to Simplify IoT Development
2022/6/8 - Case Study
EFR32MG24,MG24
Matter SoC and Module Selector Guide
2025/03/18 - Selection guide
MR21,EFR32XG26,EFR32XG24,SIWG917,RS9116,MG24,MG26,SIWG915,MG21
查看更多版本SiWG917 SoC Single Chip Wi-Fi and Bluetooth LE Wireless Secure MCU Solutions
2025/07/17 - Datasheet
SIWG917
查看更多版本Silicon Labs Ultra-low Power SiWx917 Wi-Fi 6 SoC: Ideal for Addressing Wi-Fi IoT Networking Challenges
2022-11-08 - New Product Introduction Silicon Labs is announcing the ultra-low power SiWx917 Wi-Fi 6 and Bluetooth LE SoC. SiWx917 was developed to radically reduce the energy consumption in Wi-Fi IoT networking while delivering more computing, faster AI/ML, and robust security to solve the challenges of the future.
Silicon Labs New 32-bit PG23 MCUs Bring Ultra-Low Power and High Performance to Embedded IoT Applications
2022-11-11 - New Product Introduction Silicon Labs’PG23 is a 32-bit microcontroller (MCU) that offers best-in-class security, extremely low-power operation, and software compatibility with the company’s broad portfolio of wireless SoCs. This combination makes it a good fit for industrial IoT applications.
EFR32MG21 Multiprotocol Wireless SoC Family Data Sheet
May, 2024 - Datasheet
EFR32MG21A020F512IM32-B,EFR32MG21B020F512IM32-D,EFR32MG21B020F512IM32-B,EFR32MG21A010F512IM32-B,EFR32MG21B010F512IM32-B,EFR32MG21A010F768IM32-D,EFR32MG21B020F1024IM32-B,EFR32MG21B010F1024IM32-B,EFR32MG21B010F768IM32-D,EFR32MG21B010F768IM32-B,EFR32MG21B010F1024IM32-D,EFR32MG21A010F768IM32-B,EFR32MG21B020F1024IM32-D,EFR32MG21B010F512IM32-D,EFR32MG21,EFR32MG21A010F512IM32-D,EFR32MG21B020F768IM32-B,EFR32MG21A020F768IM32-D,EFR32MG21B020F768IM32-D,EFR32MG21A020F768IM32-B,EFR32MG21A020F512IM32-D,EFR32MG21A010F1024IM32-B,EFR32MG21A020F1024IM32-D,EFR32MG21A020F1024IM32-B,EFR32MG21A010F1024IM32-D
Electronic Mall
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization

 
             
           
                 
                             
                            