The New xG27 Wireless SoCs Bring Secure High-performance Mesh Networking at the Reach of Small Smart Home Devices

2023-03-21 SILICON LABS Blogs SILICON LABORATORIES INTERNATIONAL PTE LTD

The world of IoT is going through the most profound transformation yet. It happens so close to our everyday lives – at home –we don’t even think about it. The biggest change drivers are fundamental things almost everyone can resonate with – like how to save energy at home and live more sustainably. How to make the home more convenient and efficient to cope with hectic life? Or, how to keep home safe and secure amid everything becoming digital and connected? Addressing these consumer needs could become a once-in-a-lifetime revenue opportunity for many smart home device makers. However, the challenge is integrating high-performance wireless computing and security on small, resource-constrained IoT devices.


Smart Home Growth

Homes are becoming more than they used to be – they are places for working, learning, shopping, experiencing, and more. Home-centric living drives people to invest in their homes, growing spending on smart home devices and wireless IoT applications. The wireless smart home market is expected to grow with a compound annual growth rate (CAGR) of 22 percent and reach a total value of USD 1.95 billion in 2026 globally.


To turn the ongoing smart home IoT revolution into a successful business, IoT device makers will be challenged to build smaller, smarter, more energy-efficient, and secure wireless devices such as sensors, switches, and thermostats, i.e., the devices that form the backbone of any automated home.


How to Build Small Battery-Powered Wireless Devices for Homes

Designing energy-efficient multi-node smart home solutions with constrained device capabilities and form factors is challenging. Battery-powered devices such as sensors and door locks are sensitive to energy consumption. Excessive current draw increases battery replacement frequency, costs, and waste for the user. Ultra-low-power wireless solutions help device makers optimize battery life while delivering high-performance connectivity, enhancing user experience, and minimizing battery hassles.


For battery-operated multi-node devices such as switches and dimmers, energy-efficient mesh networking technologies like Zigbee Green Power can enable high-performance connectivity in a small form factor.


Security is the #1 concern among the users of connected smart home devices. So, making compute-constrained, low-power devices more secure to protect the users’ privacy remains a crucial challenge for device makers. Many demanding technical requirements must be built into the devices at every level, down to the hardware components, software, and wireless stacks. 


The Solution is the xG27 Family of Small wireless SoCs

The Silicon Labs EFR32xG27 family of wireless SoCs is designed for battery-powered smart home IoT devices that, despite their small form factor and constrained resources, need high-performance wireless, high computing, large memory, and robust security. The xG27 packs all that and more on a compact footprint of 4x4mm to lower production costs and enable smaller and more appealing designs, all of which can be critical elements in the consumer market, where a few pennies of cost savings can be a deal breaker, and buyers make purchase decisions by the looks of the product.


The xG27 supports the Virtual Secure Engine with robust security capabilities such as tamper detection, DPA countermeasures, and secure key management with PUF, ensuring your devices won’t be the weakest link of smart home security. Additionally, xG27 is pin-compatible with the xG22 family, providing the users of BG22 and MG22 an upgrade path to more memory and higher security.


BG27 Bluetooth LE SoC

The BG27 features high-performance, ultra-low-power Bluetooth Low Energy and Bluetooth mesh with best-in-class security. It is an ideal Bluetooth enabler on various smart home devices where ultra-low-power consumption must coincide with high-performance wireless, computing, and memory capacity – these include contact sensors, temperature and humidity sensors, thermostats, HVAC controllers, locks, smart appliances, and more. The Bluetooth mesh support on BG27 will allow energy-efficient and long-range multi-node LED lighting solutions with switches and sensors.  


MG27 Multiprotocol and Zigbee SoC

The MG27 SoC family is designed for ultra-low-power Zigbee and Multiprotocol connectivity. It supports Zigbee Green Power for end nodes, routing, and proxy nodes, maximizing the battery replacement interval for the user. The ideal device types for MG27 are various battery-powered multi-node home sensors and switches.

授权代理商:世强先进(深圳)科技股份有限公司
技术资料,数据手册,3D模型库,原理图,PCB封装文件,选型指南来源平台:世强硬创平台www.sekorm.com
现货商城,价格查询,交期查询,订货,现货采购,在线购买,样品申请渠道:世强硬创平台电子商城www.sekorm.com/supply/
概念,方案,设计,选型,BOM优化,FAE技术支持,样品,加工定制,测试,量产供应服务提供:世强硬创平台www.sekorm.com
集成电路,电子元件,电子材料,电气自动化,电机,仪器全品类供应:世强硬创平台www.sekorm.com
  • +1 Like
  • Add to Favorites

This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.

Recommend

The xG27 SoC from Silicon Labs is Small (In Size) but Mighty for Connected Health Applications

2023-03-22 -  Application solution Article The BG27 SoC, in wafer-level chip scale packaging (WLCSP) with dimensions of just 2.6x2.3mm, is designed to help medical device makers put high-performance Bluetooth LE connectivity on even smaller and more challenging device form factors.

Silicon Labs Wi-Fi 6 Solutions Help You Convince Buyers by Designing More Secure Wi-Fi Devices

2024-01-17 -  Application solution Article In terms of how to convince Smart Home buyers with better Wi-Fi device security, Silicon Labs helps you with two highly secure Wi-Fi 6 solutions: SiWx917, which is an advanced ultra-low-power solution for battery-powered IoT devices, and SiWx915, which provides streamlined multiprotocol wireless and computing for line-powered devices.

Silicon Labs Redefines Smart Home Connectivity with New Concurrent Multiprotocol SoC

2025-03-10 -  Manufacturer News Silicon Labs today announced that its MG26 family of wireless SoCs is now generally available through Silicon Labs and its distribution partners. As the industry‘s most advanced, high-performance Matter and concurrent multiprotocol solution to date, the MG26 SoC features double the Flash and RAM of other Silicon Labs multiprotocol devices, advanced AI/ML processing, and best-in-class security.

Wireless SoC Enables DIY Convenience in Smart Home Devices

2023/10/20  - Case Study

EFR32MG22,EFR32MG22 SERIES

查看更多版本

SiXG301 Wireless SoC Reference Manual

2025/10/17  - User's Guide

SIXG301

Wireless SoCs target IoT

2025-09-02 -  Product Introduction Silicon Labs launches its first Series 3 wireless SoCs, built on the 22-nm process node, targeting line-powered and battery-powered IoT devices.

Silicon Labs Announces New Bluetooth SoC xG27 Family and MCU BB50 Ideal for Small Form-Factor Devices

2024-03-16 -  Product Introduction AUSTIN, Texas, March 14, 2023 /PRNewswire/ -- Silicon Labs (NASDAQ: SLAB), a leader in secure, intelligent wireless technology for a more connected world, today announced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).

SiBG301 Wireless SoC Family Data Sheet

2025/10/17  - Datasheet

SIBG301

The xG27 SoC Is Small (In Size) but Mighty for Connected Health Applications

2023-03-13 -  Product Introduction Today, we’re excited to announce a new family of low-power SoCs that enables secure, energy-friendly multiprotocol wireless networking for IoT devices, the EFR32xG27, which includes the MG27, our multiprotocol SoC and the BG27, our Bluetooth LE SoC. The BG27 enables device makers to add high-performance and secure low-power Bluetooth LE on tiny form-factor devices, expanding the possibilities of smart connected medical devices and wearables.

SiWG917 SoC Module Errata

2025/09/17  - Technical Documentation

SIWG917

查看更多版本

Smart 18 LED Driving SoC with Audio Synchronization

2025/08/18  - Datasheet

AW22118B

查看更多版本

Wireless SoC Brings DIY Convenience and Pro Level Certifications to Smart Home Devices

2021/10/11  - Supplier and Product Introduction

EFR32MG22,EFR32MG22 SERIES

查看更多版本

Now Available: Silicon Labs’ xG27 Wireless SoC Brings Small Size, High Performance to Industrial Applications

2023-07-01 -  New Product Introduction Announced in March, Silicon Labs’ EFR32xG27 (xG27) family of wireless SoCs is now available to purchase, and its feature set is ideally suited to bring new functionality and design possibilities to industrial applications. These devices have been designed for ultra-low-power, small-footprint applications.

Accelerate Smart Home Wireless Product Development With The Matter-powered Silicon Labs Mgm240 Wireless Modules

2022-10-18 -  New Product Introduction Silicon Labs MGM240 wireless modules provide smart home device makers with a low-power, high-performance wireless solution for Matter over Thread with Bluetooth LE on the same chip enabling easy commissioning for the user.

BG29 is Here – Powering the Smallest and Smartest Bluetooth LE Devices

2025-07-22 -  Product Introduction BG29 combines high compute, ultra-low power consumption, and an ultra-compact form factor. It has been engineered to meet the power and performance needs of modern IoT applications while fitting into the smallest spaces. This makes it ideal for devices where space is limited but expectations for efficiency and capability remain high.

More

Electronic Mall

More

Manufacturer:ICLEGEND MICRO

Category:K-band Smart mmWave Sensors

Auth. Dist.

Unit Price:$4.0910

In Stock:10,870

Manufacturer:MYSENTECH

Category:电容处理器芯片

Auth. Dist.

In Stock:1,008

Manufacturer:MYSENTECH

Category:电容处理器芯片

Auth. Dist.

In Stock:1,003

Manufacturer:MYSENTECH

Category:甚高频数字单端电容处理器芯片

Auth. Dist.

In Stock:1,000

Manufacturer:MYSENTECH

Category:高频数字双端互电容处理器芯片

Auth. Dist.

In Stock:980

Manufacturer:ICLEGEND MICRO

Category:K-band Smart mmWave Sensors

Auth. Dist.

Unit Price:$9.8170

In Stock:875

Manufacturer:Unicmicro

Category:PD SoC芯片

Auth. Dist.

Unit Price:$1.8871

In Stock:308

Manufacturer:INGCHIPS

Category:低功耗蓝牙5.1 SOC

Auth. Dist.

In Stock:100

Manufacturer:INGCHIPS

Category:低功耗蓝牙5.0 SOC

Auth. Dist.

In Stock:100

Manufacturer:INGCHIPS

Category:低功耗蓝牙5.1 SOC

Auth. Dist.

In Stock:100

Manufacturer:ICLEGEND MICRO

Category:K-band Smart mmWave Sensors

Auth. Dist.

Unit Price:

In Stock:

Manufacturer:MYSENTECH

Category:电容处理器芯片

Auth. Dist.

In Stock:

RFQ

Manufacturer:MYSENTECH

Category:电容处理器芯片

Auth. Dist.

In Stock:

RFQ

Manufacturer:MYSENTECH

Category:甚高频数字单端电容处理器芯片

Auth. Dist.

In Stock:

RFQ

Manufacturer:MYSENTECH

Category:高频数字双端互电容处理器芯片

Auth. Dist.

In Stock:

RFQ

Manufacturer:ICLEGEND MICRO

Category:K-band Smart mmWave Sensors

Auth. Dist.

Unit Price:

In Stock:

Manufacturer:Unicmicro

Category:PD SoC芯片

Auth. Dist.

Unit Price:

In Stock:

Manufacturer:INGCHIPS

Category:低功耗蓝牙5.1 SOC

Auth. Dist.

In Stock:

RFQ

Manufacturer:INGCHIPS

Category:低功耗蓝牙5.0 SOC

Auth. Dist.

In Stock:

RFQ

Manufacturer:INGCHIPS

Category:低功耗蓝牙5.1 SOC

Auth. Dist.

In Stock:

RFQ
connect

Contact Us

E-mail:contact@sekorm.com

Tel: +86 954668/400-830-1766