SiWG917 SoC Single Chip Wi-Fi® and Bluetooth® LE Wireless Secure MCU Solutions

PublishTime： 2024-01-31 Manufacturer： Silicon Labs Type： Datasheet Language： English

●Silicon Labs SiWG917 SoC is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4 SoC, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. SiWG917 SoC includes an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller (MCU) application subsystem, security, peripherals and power management subsystem all in a single 7x7 mm QFN package. The wireless subsystem consists of a multi-threaded processor (ThreadArch®) running up to 160 MHz, baseband digital signal processing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz, embedded SRAM, FLASH, ultra-low power sensor hub and AI/ML accelerator. The ARM® Cortex®- M4 is dedicated for peripheral and application-related processing, while the ThreadArch® runs the wireless and networking stacks on independent threads, thus providing a fully integrated solution that is ready for a wide range of embedded wireless IoT applications.
■KEY FEATURES
●Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1 stream IEEE 802.11 b/g/n/ax
●Bluetooth LE 5.4
●Single chip Matter Over Wi-Fi Solution
●ARM® Cortex® M4 Processor with FPU subsystem up to 180 MHz with rich set of Digital and Analog Peripherals.
●Wi-Fi 6 Benefits: TWT for improved efficiency and longer battery life, MU- MIMO/OFDMA for Higher Throughput, network capacity and low latency
●Best in Class Device and Wireless Security
●WLAN Tx power up to +20 dBm with integrated PA
●Bluetooth LE Tx power up to +19.5 dBm with integrated PA
●WLAN Rx sensitivity as low as -97.5 dBm
●Wi-Fi Standby Associated mode current: 55 μA @ 1-second listen interval
●Embedded Flash option up to 8 MB/ optional external Flash up to 16 MB
●Embedded PSRAM option up to 8 MB/ optional external PSRAM option up to 16 MB
●Ultra-low power sensor hub peripherals
●AI/ML Hardware Accelerator (MVP)
●Embedded Wi-Fi, Bluetooth LE, Matter, and networking stacks supporting wireless coexistence
●Three software-configurable MCU application memory options for sharing the RAM between the wireless, system, and application (192/256/320 kB)
●Operating temperature: -40 ºC to +85 ºC
●Wide operating supply range: 1.71 V to 3.63 V

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