SiWG917 SoC Single Chip Wi-Fi® and Bluetooth® LE Wireless Secure MCU Solutions
●Silicon Labs SiWG917 SoC is our lowest power Wi-Fi 6 plus Bluetooth LE 5.4 SoC, ideal for ultra-low power IoT wireless devices using Wi-Fi®, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devicesthat need long battery life. SiWG917 SoC includes an ultra-low power Wi-Fi 6 plus Blue-tooth Low Energy (LE) 5.4 wireless CPU subsystem, and an integrated micro-controller(MCU) application subsystem, security, peripherals and power management subsystemall in a single 7x7 mm QFN package. The wireless subsystem consists of a multi-threa-ded Network Wireless Processor (NWP) running up to 160 MHz, baseband digital signalprocessing, analog front end, 2.4 GHz RF transceiver and integrated power amplifier. The application subsystem consists of an ARM® Cortex®-M4 running up to 180 MHz,embedded SRAM, FLASH, ultra-low power sensor hub, and matrix vector processor.The ARM® Cortex®-M4 is dedicated for peripheral and application-related processing,while the NWP runs the wireless and networking stacks on independent threads, thusproviding a fully integrated solution that is ready for a wide range of embedded wireless IoT applications.
■KEY FEATURES
●Wi-Fi 6 Single Band 2.4 GHz 20 MHz 1x1stream IEEE 802.11 b/g/n/ax
●Bluetooth LE 5.4
●Single chip Matter Over Wi-Fi Solution
●ARM® Cortex® M4 Processor with FPUsubsystem up to 180 MHz with rich set ofDigital and Analog Peripherals.
●Wi-Fi 6 Benefits: TWT for improvedefficiency and longer battery life, MU-MIMO/OFDMA for Higher Throughput,network capacity and low latency
●Best in Class Device and WirelessSecurity
●WLAN Tx power up to +19.5 dBm withintegrated PA
●Bluetooth LE Tx power up to +19 dBmwith integrated PA
●WLAN Rx sensitivity as low as -97.5 dBm
●Wi-Fi Standby Associated mode current:65 μA @ 1-second listen interval
●Embedded Flash option up to 8 MB/optional external Flash up to 16 MB
●Embedded PSRAM option up to 8 MB/optional external PSRAM option up to 16MB
●Ultra-low power sensor hub peripherals
●Matrix Vector Processor (MVP)
●Embedded Wi-Fi, Bluetooth LE, Matter,and networking stacks supporting wirelesscoexistence
●Three software-configurable MCUapplication memory options for sharing theRAM between the wireless, system, andapplication (192/256/320 KB)
●Operating temperature: -40 ℃ to +85 ℃
●Single or dual-supply operation:
●Single supply: 3.3 V
●Dual supply: 3.3 V and 1.8 V
| 世强硬创平台www.sekorm.com | |
| 世强硬创平台电子商城www.sekorm.com/supply/ | |
| 世强硬创平台www.sekorm.com | |
| 世强硬创平台www.sekorm.com |
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