Introduction of Thermal Gel and Its Application
The Thermal Gel series is a two-component preformed thermal grease product that meets the requirements of low pressure, high compression modulus when used in the product, enabling automated production, good contact with electronic products when assembled a lower contact resistance, and good electrical insulation properties. This material also has some advantages of thermal pads and thermal grease, which makes up for the weaknesses of both.
The thermal gel has the advantages of good affinity, good weather ability, high and low-temperature resistance, and good insulation. At the same time, the plasticity is strong enough to meet the filling of the uneven interface, which can meet the heat transfer demand of various applications. With high thermal conductivity, low compression force applications, low pressure, high compression ratio, high electrical insulation, and good resistance to new energy, thermal gel can be used to achieve the performance of automation.
Performance Characteristics
The thermally conductive gel, which is softer and has better surface affinity, can be compressed to a very low thickness relative to the thermal pad, resulting in a significant increase in heat transfer efficiency and a minimum compression of 0.1 mm. The thermal resistance at this time 0.08℃ · in²/W - 0.3℃ · in²/W, can reach the performance of part of the grease. In addition, the thermal gel has almost no hardness and, after the use of equipment will not produce internal stress.
Thermal Gel Gel is easier to handle than thermal grease. The general use of silicone grease is screen or steel plate printing or direct brushing, the user and the environment are very friendly, and because of its certain flow, generally can not be used for a thickness of 0.2mm or more occasions.
And the conductive mud is arbitrarily shaped into the desired shape, and the uneven PCB board and the irregular device (such as the battery, the corner of the component, etc.), are able to ensure good contact.
Thermal gel has a certain adhesion, and there will be no oil and dry problems, in the reliability of a certain advantage.
Application of Thermal Gel
Thermally conductive gels are widely used in LED chips, communications equipment, mobile CPUs, memory modules, IGBTs and other power modules, and power semiconductors.
The application is the LED bulb in the drive power applications. In the export of LED lights, in order to UL certification, the manufacturer more use of two-component potting. Exports to the United States lamps require a 50,000-hour warranty the current quality of LED lamp beads is no problem, the main failure is the power supply, the use of plastic potting power can not be demolished, only the whole lamp is discarded. If the use of thermal insulation on the power of the local filling, you can effectively carry out the heat, if the power supply problems can also be easily replaced by the power supply for the enterprise to save costs. Of course, for the requirements of waterproof lights. Because the heat transfer mud can not be the same as the potting of all and the gap to fill, can not be waterproof and moisture, still need to use potting.
Another typical application is in the LED fluorescent tube, the power on the two ends of the design, in order not to take up the size of the lamp, the two power supply space is relatively small, and 1.2 meters LED fluorescent lamp power is usually designed to 18w to 20w so that the heat to drive the power becomes larger. The heat transfer mud can be filled into the gap of the power supply, especially attached to the power device to help heat the lamp to extend its life. For some of the sealed module power supplies, you can use the heat transfer mud for local filling to achieve the effect of heat conduction.
Then the chip heat, in this way, we should also be more familiar with the same processor and the middle of the kind of silicon heat sink is a principle, its role is to allow the processor to send the heat can be faster To the radiator to emit out.
Similarly, thermal gel can also be used in mobile phone processors. Huawei's mobile phone processors will use thermal conductivity similar to silicone grease, which is better than the contact effect of a thermal conductivity film with only viscous graphite, and the thermal conductivity will be faster.
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