12 mm Low-inductive Housing Baseplate-less Housing Flow S3 That Enables Higher Power Density And More Compact Designs
The novel baseplate-less housing flow S3 comprises 67% more ceramic area than flow 1. Together with the low thermal resistance, flow S3 enables higher power density and more compact designs. Low inductivity is ensured by low profile 12 mm package, free pin positioning and the possibility to integrate ceramic capacitors. Get more options for your design, get more options for your budget. Learn more about flow S3 housing.
Main Benefits
More power, same footprint
Superior thermal performance
Compact, lightweight designs
A low-inductive housing built for higher switching frequenciesSmaller price tag
No copper baseplateLower production cost
Press-fit pins and pre-applied TIM
General Features
CTI600 housing material
12 mm low-inductive housing
Fast, easy assembly
Press-fit pins with stress-relief zone
Pre-applied phase-change material
Advanced die attach technology
Applications
Solar, Industrial Drives, Charging Stations, UPS
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