How to Achieve uPOL Packaging Technology for High Current Density Power Supply Breakthrough--6A DC Step-down Power Module ISM6636x Series

PublishTime： 2023-09-07 Article Source：Innovision Semiconductor News

In recent years, power management IC has been deepening into the field of efficient and streamlined application, driving the power chip toward a larger current, smaller volume, more efficiency, and more strict voltage feedback accuracy direction. On the one hand, traditional power chips need to configure a large number of peripheral devices; on the other hand, in order to better optimize the electrical and thermal performance of the chip, users often need to complete tedious routing and layout. Minimalist periphery, high efficiency, and high performance are the inevitable trends of the development of power modules.

Future POL module package turns to micro load power (μ POL^TM) Development, this packaging method has a great optimization of POL performance.μPOL^TMUsing advanced panel-level packaging form, the power chip, inductor capacitors, and other devices are integrated into the substrate to form an ultra-high integration power chip module. Under the demand of high space utilization rate and strong power supply capacity of electronic products, the inductors placed in the peripheral of the traditional switch power supply chip and many peripheral parameter adjustment devices are undoubtedly a big obstacle to compressing the space of the circuit board. In the application, in order to ensure the normal work of the chip, more PCB area needs to be sacrificed, which is not conducive to the development of electronic equipment for miniaturization. The modular packaging benefits from its small volume, high integration, and minimalist peripheral application circuit, which can reduce the PCB area of the power supply chip, effectively improve the utilization rate of the PCB of users, and meet the needs of increasingly small electronic equipment. At the same time, the chip is directly embedded in the substrate, which greatly increases the heat dissipation area of the whole module, even in the full load working state, the temperature will not be too high.

In the traditional power chip, the chip and inductive heat production cause the temperature between the plate, and the working efficiency of the chip will be reduced. Profit from μPOL^TMExcellent heat dissipation performance, the efficiency and thermal performance of the module have been significantly improved.

In view of the power supply demand, long work microelectronics launched using μ POL^TMThe smallest 6A DC step-down power module in the industry- - -ISM6636x (x representative material number A / B / C). The highly compact load point module adopts a 3.3mm 1.45mm micro package, which can support 4.5V~16V input, output support 0.6V~5V, highest peak current up to 8A, and continuous working current up to 6A. In addition to the POL chip, ISM6636A / B / C also integrates the output inductance, bootstrap capacitor, and VCC bypass capacitor into the module, which greatly reduces the motherboard space occupied by the module in practical applications. At the same time, ISM6636x supports the internal configuration of IIC communication deployment module, which further simplifies the application of the module. Figure 1 illustrates the application advantages of the simplified peripheral devices highlighted by ISM6636x. ISM6636x A DC step-down chip with 6A load is integrated on a 3cm substrate, and the bootstrap capacitor, VCC bypass capacitor, and power inductance are arranged above the substrate. The periphery only needs input and output and the VCC bypass capacitor works normally, which reduces the design difficulty for users and saves the space resources of PCB.

In terms of efficiency and thermal performance, ISM6636x adopts the substrate packaging mode, which is conducive to heat dissipation. The integrated design of magnetic devices and capacitors enables the substrate and devices to have a fixed and excellent routing arrangement so that the electrical performance and efficiency of the chip can reach an excellent state. Figures 2 and 3 are shown using μ The relationship between the efficiency, temperature, and current of the packaged ISM6636x under different output voltage, without external heat dissipation measures. Thus, the excellent heat dissipation performance of ISM6636x enables excellent working temperature and efficiency.

ISM6636x The vertical structure reduces the actual application volume, optimizing the thermal performance while taking into account good reliability. It has passed a number of reliability tests of JEDEC standard, including temperature cycle test, high-temperature cooking test, high-temperature storage test, aging life test, charged high temperature and high humidity acceleration test, etc. At the same time, ISM6636x also has an ESD protection function of more than 2kV to escort the subsequent production and manufacturing.

As the smallest 6A DC step-down power module in the industry, ISM6636x has the advantages of micro packaging and minimalist periphery, with the advantages of a smaller application area, more perfect programmable function, excellent electrical characteristics, and dynamic performance. Whether it's a performance and stable server and communications device, or a loss and size data center, ISM6636x offers the perfect solution. As a domestic power chip enterprise, Changgong Micro has once again proved to the world that "China core", contributing to the domestic low voltage and high current power module field!

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

New Products & Solutions

More>

This document is provided by Sekorm Platform for VIP exclusive service. The copyright is owned by Sekorm. Without authorization, any medias, websites or individual are not allowed to reprint. When authorizing the reprint, the link of www.sekorm.com must be indicated.

Integrated Circuits