Runic Level Conversion Chips Won the “2021 China IC Design Achievement Award for the Best Amplifier/Data Converter“ Award

PublishTime： 2021-05-04 Article Source：Runic

Runic Technology returns with honor

On March 18th, the 2021 China IC Leadership Summit and the 2021 China IC Design Achievement Award Selection and Presentation Ceremony hosted by the International Electronics Business Information Flat conversion chip, won the "2021 China IC Design Achievement Award for the Best Amplifier/Data Converter of the Year" award in one fell swoop.

At the IC Leadership Summit, Runic Technology was nominated in the "China IC Design Achievement Award" in the "Five Chinese Innovative IC Design Companies", "Five Chinese Potential IC Design Companies" and the product awards in the "Amplifier/Data Converter" category.

About Runic Technology RSO1OX Series Level Conversion

Runic Technology level conversion series chips include single-channel RS0101, dual-channel RS0102, four-channel RS0104, and 8-channel RS0108, which can be used for communication interfaces such as I2C, UART, SPI, I2S, bus interface, GPIO, etc., automatic identification Direction, compatible with push-pull output architecture and open-drain output architecture, its main features are as follows:

●No need for data direction control;
      ●The push-pull architecture supports 24Mbps data rate, the open-drain architecture supports 2Mbps data rate;
      ●The A-side supports 1.65V~5.5V, and the B side supports 2.3V~5.5V;
      ●A and B side power supplies are isolated from each other;
      ●No power-on sequence requirements;
      ●Support -40°C~+85°C.

About 2021 China IC Leadership Summit

The 2021 China IC Leadership Summit and China IC Design Achievement Award Presentation Ceremony were grandly held yesterday by International Electronic Business at the Shanghai Kempinski Hotel. The theme of this summit is "Breakthrough and Rise", bringing together technical experts in China’s IC design industry, Enterprise management elites, as well as representatives from the fields of EDA/IP, foundry and packaging and testing at home and abroad, discussed with the majority of design engineers and middle and senior management personnel in the electronics/semiconductor industry the technological breakthroughs of China's semiconductors and the way to the rise of the industry. At the same time, the summit also arranged the "2021 China IC Design Achievement Award Ceremony", "Global and Chinese Semiconductor Development Status and Future Trends", "IC Design Engineers and Corporate Executives Survey Report", "SoC Design Forum", and "Online Virtual Exhibition". "China Fabless100 Ranking", "China Fabless Spring New Product Launch Conference" and other activities, this summit will link online and offline real-time global video live broadcast.

About 2021 China IC Design Award

2021 is the 19th consecutive year that IC design surveys and award selections have been held, attracting the attention of IC design engineers and corporate executives. Along the way, the award selection has upheld fair and objective selection criteria and has been widely recognized by the industry. The China IC Design Achievement Award has become one of the most professional and influential technology awards in the Chinese electronics industry. This year, nearly 50 subdivided awards in four categories including IC design company awards, popular IC product awards, upstream service provider awards, and analyst recommendation awards were selected.

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