Reliability Meets Flexibility in MiniSKiiP® Advanced Die-attach Technology
Longer operating time at high temperatures is a feature that is expected from power modules these days. Vincotech takes on that challenge with advanced new die-attach technology to strengthen the bond between chips and DCBs all across the MiniSKiiP® line.
Featuring latest-generation IGBT M7 and IGBT7 chips, Vincotech MiniSKiiP® products deliver the dual benefits of superior performance and multiple sourcing for flexible and scalable inverter designs with nominal currents ranging from 5 A up to 200 A.
Samples of the MiniSKiiP® with IGBT7 or IGBT M7 are available through our usual channels.
Main benefits
More than ten times longer life at high operating temperatures.
Latest-gen chips up efficiency and power density to help drive down system costs.
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