MiniSKiiP®PIM and MiniSKiiP®PACK with IGBT M7 - for Real Chip-level Multi Sourcing
The MiniSKiiP®PIM and MiniSKiiP®PACK with IGBT M7 - for real chip-level multi sourcing.
Vincotech is more than 10 years reliable partner for MiniSKiiP® power modules. To rule out any and all supply chain issues, Vincotech now owns the tools needed to prep housings and new machines for MiniSkiiP products. Count on us to fulfill our delivery promise with these added assets. Additionally, Vincotech has extended its range of MiniSKiiP® products with the new IGBT M7 chip. This IGBT M7 chip delivers the dual benefits of superior performance and multiple sourcing to minimize customers‘ supply chain risks. Discover the new MiniSKiiP® PIM (CIB) and MiniSKiiP® sixpack configurations with power ranges extending up to 200A.
Main benefits
Multiple sourcing for enhanced supply chain security
Lower power losses and improved efficiency
Extended power range for easily scalable inverter designs
Pre-applied, high-performance thermal paste (HPTP) for superior thermal performance
General MiniSKiiP® Features
Solder-free SPRiNG Technology for the shortest assembly time
Without copper baseplate for cost efficiency
Easy and flexible PCB routing without pin holes
Real chip-level multiple sourcing: TRENCHSTOPTM IGBT3/IGBT4 and new IGBT M7 with low VCEsat
Open emitter configuration
Kelvin emitter for improved switching performance
5.5kV DC test isolation voltage (t = 2sec)
Compatible pin out for IGBT4 and IGBT M7
Built-in NTC
MiniSKiiP® PIM features
Single- and three-phase rectifier (standard/enhanced)
600V and 1200V components
Available from 5A up to 100A
For inverter designs up to 45kW
MiniSKiiP® Sixpack features
Sixpack or twin sixpack configuration
600V and 1200V components
Available from 10A up to 200A (with IGBT M7)
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