THERM-A-GAP® PAD 80 8.3 W/m-K Thermally Conductive High Performance Gap Filler Pad

PublishTime：2025-04-10

THERM-A-GAP® PAD 80 is a high-performance, thermally conductive gap filler pad with a typical thermal conductivity of 8.3 W/m-K. It provides excellent heat transfer over a variety of thicknesses while maintaining low compression force and surface matching adaptability. The product is designed as an effective thermal interface between heat sinks and heat sources in electronic devices, suitable for situations with uneven surfaces, air gaps, and rough surfaces. PAD 80 is available in standard thicknesses from 0.030” to 0.200” (0.76mm to 5.1mm) and can be customized in size. It is available on a variety of material substrates, including foil with pressure-sensitive adhesive (PSA) to enhance bonding strength during assembly.

Brand of Product：	Parker Chomerics
Part#：	THERM-A-GAP® PAD 80 More Part#
Product Category：	热间隙填充垫 More
Application：	[ 5G 和电信设备 ][ 智能家居设备 ][ 汽车电子产品 ][ LED ][ 电源 ][ 计算模块和服务器 ][ 内存和数据存储单元 ] More
Data Type：	Supplier and Product Introduction More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	可定制尺寸，包括铝箔载体、编织玻璃载体和PEN薄膜载体
Language：	English Chinese Chinese and English Japanese
Date of Creation：	March 2025
Version Number：	CHODS1054 March 2025
Data Encoding：
Data Size：	518 KB

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