PHOTRAK™ ETAP240/2968 SP Aqueous Developable PHOTOIMAGEABLE ALKALI or ACID ETCH and PLATE RESIST FOR SCREEN & SPRAY APPLICATIONS
■Photrak™ ETAP240 is a contact exposure, negative working photoimageable etch and plate resist, formulated for use as a cost effective alternative to dry film-resist in the manufacture of high density multi-layer printed circuit boards.
■It can be applied by air-spray or screen-printing and is suitable for use with alkali and acid etchant solutions and plating solutions.
■After etching or plating it is easily removed in a sodium hydroxide solution or proprietary resist strippers.
●FEATURES & ADVANTAGES
■<25μm (1 mil) resolution capability.
■Fast exposure. Approx. 5-15s using standard 5kW PC equipment. Avoids bottle necks at photoprinting stage and maintains fast throughput particularly with automatic exposure units.
■Excellent adhesion and conformance to copper surfaces. The liquid system flows into copper/laminate defects leading to increased fine line yields.
■Single pack system. No mixing or weighing.
■High acid & alkali etch resistance. High copper weights are easily processed without attack to the resist.
■Reduced developer and stripper costs. Reduced resist thickness leads to less waste treatment.
■Low cost. No waste. 100% material utilisation.
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Aqueous Developable PHOTOIMAGEABLE ALKALI ETCH and PLATE RESIST 、 Aqueous Developable PHOTOIMAGEABLE ACID ETCH and PLATE RESIST 、 contact exposure, negative working photoimageable etch and plate resist |
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[ SCREEN ][ SPRAY ][ high density multi-layer printed circuit boards ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2008/10/16 |
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rev5 |
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135 KB |
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