PHOTRAK™ ETP240 Aqueous Developable PHOTOIMAGEABLE ETCH-RESIST FOR UNIVERSAL APPLICATION TECHNICAL DATA SHEET
■Photrak™ ETP240 is a contact exposure, negative working photoimageable etch- resist, formulated for use as a cost effective alternative to dry film-resist in the manufacture of high density multi-layer printed circuit boards.
■It can be applied by screen-printing (SP), curtain-coat (CC), electrostatic spray (ES), air-spray (AS) or roller-coating (RC) and is suitable for use with acid etchant solutions.
■After etching it is easily removed in a sodium hydroxide solution or proprietary resist strippers.
●FEATURES & ADVANTAGES
■<25∝m (1 mil) resolution capability.
■Fast exposure. Approx. 5s using standard 5kW PC equipment. Avoids bottle necks at photoprinting stage and maintains fast throughput particularly with automatic exposure units.
■Excellent adhesion and conformance to copper surfaces. The liquid system flows into copper/laminate defects leading to increased fine line yields.
■Single pack system. No mixing or weighing.
■High acid-etch resistance. High copper weights are easily processed without attack to the resist.
■Reduced developer and stripper costs. Reduced resist thickness leads to 60% less waste treatment.
■Low cost. No waste. 100% material utilisation.
|
|
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
2005/3/31 |
|
|
rev11 |
|
|
|
|
|
194 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
