ELECTRAΩ D’OR™ ED2075 CONDUCTIVE VIA HOLE-PLUG TECHNICAL DATA SHEET
■ED2075 is a single component, solvent-free, silver-filled, epoxy system designed for plugging blind or buried via holes with or without through-hole-plating.
■Rheological characteristics are optimised to allow effective plugging of aspect ratios up to 6:1 using conventional screen or stencil techniques.
■The 100% solids composition prevents shrinkage or voiding of the finished via plug.
●FEATURES & BENEFITS
■Eliminates the need for excessive copper plating processes.
■100% solids composition allows no shrinkage or solvent entrapment in via holes.
■Excellent screen stability allowing reduced material wastage from excessive clean-up.
■High electrical and thermal conductivity allows good inner layer connection and improved thermal management.
■Excellent adhesion to copper and laminate surfaces
■Compatibility with copper plating techniques allows increased use of real estate through via in pad applications
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2007/2/16 |
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rev5 |
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167 KB |
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