Product Samples ATP1008: Plated Gold Bumps

PublishTime：2024-08-30

●Applied Thin-Film Products (ATP) is pleased to provide ceramic thin-film samples for your evaluation.

●TaN/TiW/Au metalization with plated Gold Bumps on Aluminum Oxide(Al₂O₃). Gold Bumps are used to eliminate wire bonding, which will improve electrical performance at higher frequencies. This is done by eliminating long bond wires and flipping the chip onto the Gold contact bumps.

●ATP1008: Material is 15 mil As-Fired Al₂O₃

■TiW = 400 –800 Ångströms

■Au = 120μ" minimum

■Bump Height = 24 microns ±6 microns

Brand of Product：	Applied Thin-Film Products
Part#：	ATP1008 More Part#
Product Category：	ceramic thin-film More
Application：	More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	200521
Version Number：	Version 200521
Data Encoding：
Data Size：	679 KB

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