Product Samples ATP1004: AlN Submount — Thermal Solderable

PublishTime：2024-08-30

●Applied Thin-Film Products (ATP) is pleased to provide ceramic thin-film samples for your evaluation.

●TiW/Pd/Au is a solderable metalization scheme on Aluminum Nitride (AlN). AlN has a thermal conductivity of 170Watts/mK and is ideal for thermal applications with mounting and aligning the most sensitive light emitting diodes.

●ATP1004: Material is 15 mil AlN

■TiW = 400–800 Ångströms

■Pd = 1000–1500 Ångströms

■Au = 120μ" minimum

Brand of Product：	Applied Thin-Film Products
Part#：	ATP1004 More Part#
Product Category：	AlN Submount 、 ceramic thin-film More
Application：	[ thermal applications ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	200521
Version Number：	Version 200521
Data Encoding：
Data Size：	184 KB

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