Product Samples ATP1006: Plated Thru Vias
●Applied Thin-Film Products (ATP) is pleased to provide ceramic fhin-film samples for your evaluation.
●TaN/TiW/Au metalization with CO2 laser drilled conductive plated thru via holes in Aluminum Oxide (Al2O3) provides a cost effective solution for applications that require interconnects to ground. The conductive plated thru vias replace the tedious process of bonding from the top side of the circuit to ground.
●ATP1006: Material is 15 mil As-Fired Al2O3
■TaN Resistors = 50 Ohms per Square
■TiW = 400 –800 Ångströms
■Au = 120μ" minimum
■Does not have indicator on circuit
■Via Hole Size: 0.015" ±0.002"
|
|
Datasheet |
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
200521 |
|
Version 200521 |
|
|
|
434 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.