Product Samples ATP1003: Palladium Metallization Solderable
●Applied Thin-Film Products (ATP) is pleased to provide ceramic thin-film samples for your evaluation.
●TaN/TiW/Pd/Au metalization on Aluminum Oxide (Al2O3) is a wire bondable metalization scheme processed in a proprietary manner that reduces the amount of Au "leaching" that commonly occurs during densely populated high temperature attachments, such as Gold Germanium and Gold Silicon. This process allows a good fillet attachment around your components without leaching outlining areas.
●ATP1003: Material is 15 mil As-Fired Al2O3
■TaN Resistors = 50 Ohms per Square
■TiW = 400–800 Ångströms
■Pd = 1000–1500 Ångströms
■Au = 120μ" minimum
■Has “Pd” indicator on circuit
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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200521 |
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Version 200521 |
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433 KB |
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